Assembly Technology Roadmap
| Item | HVM | 2020 | 2021 | ||
|---|---|---|---|---|---|
| Wafer size(inch) | Si wafer | 6,8,12 | ← | ← | |
| GaAs | 3,6 | ← | ← | ||
| Min.wafer thickness(μm) | 50 | 45 | 40 | ||
| Min.chip size(mm) | 0.09×0.09 | ← | ← | ||
| Scribe width(μm) | 46 | 40 | 30 | ||
| Gold wire | Normal bond | Min.PP(Min.BPO)(μm) | 50(42) | ← | ← |
| WD(μm) | 15～28 | ← | ← | ||
| Pad to Pad | Min.PP(Min.BPO)(μm) | 55(47) | ← | ← | |
| WD(μm) | 18～23 | ← | ← | ||
| Min.loop height(μm) | 32 | ← | 30 | ||
| Cu wire(PCC) | Normal bond | Min.PP(Min.BPO)(μm) | 50(42) | ← | ← |
| WD(μm) | 18,20,23,25,28,30,38,50 | ← | ← | ||
| Pad to Pad | Min.PP(Min.BPO)(μm) | 55(47) | ← | ← | |
| WD(μm) | 18,20,25,30 | 18,20,25,30,35 | ← | ||
| Min.loop height(μm) | 40 | ← | ← | ||
| Compound thickness(mm) | Compression mold | 0.06～2.5 | ← | 0.04～2.5 | |
| Vacuum mold | 0.65 | 0.65,0.55,0.45 | 0.65,0.55,0.45,0.3,0.25,0.17,0.06 | ||
Max.wire length & wire diameter(Cu wire)
| Wire Diameter | FBGA | QFP | QFN | SOP | SIP | Module |
|---|---|---|---|---|---|---|
| 28um (1.1mil) |
4318um (170mil) |
5588um (220mil) |
4826um (190mil) |
3810um (150mil) |
4826um (190mil) |
4826um (190mil) |
| 25um (1.0mil) |
4064um (160mil) |
5334um (210mil) |
4572um (180mil) |
3556um (140mil) |
4572um (180mil) |
4572um (180mil) |
| 23um (0.9mil) |
3810um (150mil) |
5080um (200mil) |
4318um (170mil) |
3302um (130mil) |
4318um (170mil) |
4318um (170mil) |
| 20um (0.8mil) |
3302um (130mil) |
4826um (190mil) |
4064um (160mil) |
3048um (120mil) |
4064um (160mil) |
4064um (160mil) |
| 18um (0.7mil) |
3048um (120mil) |
3810um (150mil) |
3556um (140mil) |
2540um (100mil) |
3556um (140mil) |
3556um (140mil) |
