Technology Roadmap 製品情報

Assembly Technology Roadmap

Item HVM 2020 2021
Wafer size(inch) Si wafer 6,8,12
GaAs 3,6
Min.wafer thickness(μm) 50 45 40
Min.chip size(mm) 0.09×0.09
Scribe width(μm) 46 40 30
Gold wire Normal bond Min.PP(Min.BPO)(μm) 50(42)
WD(μm) 15~28
Pad to Pad Min.PP(Min.BPO)(μm) 55(47)
WD(μm) 18~23
Min.loop height(μm) 32 30
Cu wire(PCC) Normal bond Min.PP(Min.BPO)(μm) 50(42)
WD(μm) 18,20,23,25,28,30,38,50
Pad to Pad Min.PP(Min.BPO)(μm) 55(47)
WD(μm) 18,20,25,30 18,20,25,30,35
Min.loop height(μm) 40
Compound thickness(mm) Compression mold 0.06~2.5 0.04~2.5
Vacuum mold 0.65 0.65,0.55,0.45 0.65,0.55,0.45,0.3,0.25,0.17,0.06

 

Max.wire length & wire diameter(Cu wire)

Wire Diameter FBGA QFP QFN SOP SIP Module
28um
(1.1mil)
4318um
(170mil)
5588um
(220mil)
4826um
(190mil)
3810um
(150mil)
4826um
(190mil)
4826um
(190mil)
25um
(1.0mil)
4064um
(160mil)
5334um
(210mil)
4572um
(180mil)
3556um
(140mil)
4572um
(180mil)
4572um
(180mil)
23um
(0.9mil)
3810um
(150mil)
5080um
(200mil)
4318um
(170mil)
3302um
(130mil)
4318um
(170mil)
4318um
(170mil)
20um
(0.8mil)
3302um
(130mil)
4826um
(190mil)
4064um
(160mil)
3048um
(120mil)
4064um
(160mil)
4064um
(160mil)
18um
(0.7mil)
3048um
(120mil)
3810um
(150mil)
3556um
(140mil)
2540um
(100mil)
3556um
(140mil)
3556um
(140mil)